SEMIL-1300GC

Wide-temperature Fanless GPU Computer supporting NVIDIA® Tesla T4/ Quadro P2200 GPU and Intel® Xeon® E or 9th/ 8th-Gen Core™ CPU with M12 connectors

SEMIL-1300GC series is the world's first wide-temperature fanless edge AI computer supporting NVIDIA® Tesla T4 or Quadro P2200 for demanding environments. Coupled with Intel® Xeon® E or 9th/ 8th-Gen Core™ CPU, the system delivers excellent CPU and GPU performances for modern edge AI applications. SEMIL-1300GC series features Neousys' patented thermal system architecture* to guarantee -25°C to 70°C fanless operation in a rackmountable or wall-mountable 2U 19" enclosure.

SEMIL-1300GC series features an advanced passive cooling design to ensure operation in high-temperature environments without the GPU throttling. Compatible with a Tesla T4 or Quadro P2200 GPU, users can utilize the scalable GPU performance up to 8.1 TFLOPS in FP32 or 130 TOPS in INT8. It leverages M12 connectors for Gigabit PoE+, USB 2.0, VGA and COM ports to offer rugged cable connectivity. Other high-speed computer I/Os include DisplayPort, USB 3.1 Gen1, optional 10G Ethernet and storage interfaces such as M2. for NVMe SSD and SATA ports, making SEMIL-1300GC expandable and versatile.

The flourishing GPU-powered deep learning systems actualized real-time AI inference applications at the edge, where rough conditions are expected. Combining Tesla T4 or Quadro P2200, wide-temperature fanless design and rugged M12 connectors, the SEMIL-1300GC series reveals unprecedented possibilities of deploying AI to places that have yet to be reached.

Features:

• Fanless GPU computer with NVIDIA® Tesla T4/ Quadro P2200
• Guaranteed non-throttling GPU performance up to 62°C ambient
• Intel® Xeon® E or 9th/ 8th-Gen Core™ i7/ i5/ i3 CPU
• Patented 2U 19" chassis for rack or wall-mount
• Four 802.3at Gigabit PoE+ ports via M12 X-coded connectors
• VGA, USB 2.0 and COM ports via M12 A-coded connectors
• 1x DisplayPort and 3x USB 3.1 Gen1 ports
• 8V to 48V wide-range DC input with built-in ignition power control
• CE, FCC and EN 50155 certified

Specification:

System Core:

• Processor: Supporting Intel® Xeon® E and 9th/ 8th-Gen CPU (LGA1151 socket)- Xeon E 2278GE (8C/16T) / 2278GEL (8C/16T) / 2176G (6C/12T)- i7-9700E, i7-9700TE, i7-8700, i7-8700T- i5-9500E, i5-9500TE, i5-8500, i5-8500T- i3-9100E, i3-9100TE, i3-8100, i3-8100T
• Chipset: Intel® C246 platform controller hub
• Graphics: Integrated Intel® UHD Graphics 630
• Acceleration GPU: NVIDIA® Tesla T4 for AI inference, NVIDIA® Quadro P2200 for AI inference
• Memory: Up to 64 GB ECC/ non-ECC DDR4-2666/ 2400 SDRAM(two SODIMM sockets)
• AMT: Supports AMT 12.0
• TPM: Supports TPM 2.0

I/O Interface:

• PoE+: 1x IEEE 802.3at (25.5W) Gigabit PoE+ ports by Intel® I219 (M12 X-coded)3x IEEE 802.3at (25.5W) Gigabit PoE+ ports by Intel® I210 (M12 X-coded)
• 10 GbE Port(Build Option): Optional: 1x 10 GbE port by Intel® X550AT controller (M12 X-coded)**
• Native Video Port: 1x VGA (M12 A-coded), supporting 1920 x 1200 resolution1x DisplayPort connector, supporting 4096 x 2304 resolution
• Series Port: 2x 3-wires RS-232 ports COM1 & COM2 (M12 A-coded)1x software-programmable RS-232/ 422/ 485 port (COM3, DB9)1x RS-232 port (COM4, DB9)
• USB: 3x USB 3.1 Gen1, 2x USB 2.0 (M12 A-coded), 1x USB 2.0 (internal)
• Audio:1x 3.5 mm jack for mic-in and speaker-out

Storage Interface:

• SATA HDD: 2x Internal SATA port for 2.5" HDD/ SSD installation, supporting RAID 0/ 1
• mSATA: 2x full-size mSATA port (mux with mini-PCIe)
• M.2: 1x M.2 2280 M key socket (PCIe Gen3 x4) for NVMe SSD or Intel® Optane™ memory installation

Expansion Bus:

• Mini PCI-E: 2x full-size mini PCI Express sockets (mux with mSATA), 1x M.2 3042/ 3052 B key socket for selected M.2 4G/ 5G module, 1x M.2 2242/ 2252 E key for selected WiFi module

Power Supply:

• DC Input: 8V to 48V DC input
• Ignition Control: Built-in ignition power control

Mechanical:

• Dimension: 440mm (W) x 310mm (D) x 86.5mm (H) (excl. rack-mount bracket)
• Weight: 12kg
• Mounting: Rack-mounting and wall-mounting

Environmental:

• Operating Temperature: with 35W CPU -25°C ~ 70°C ****, with >= 65W CPU -25°C ~ 70°C ***/ **** (configured as 35W TDP mode), -25°C ~ 50°C ***/ **** (configured as 65W TDP mode)
• Storage Temperature: -40°C ~85°C
• Humidity:10%~90%, non-condensing
• Vibration: MIL-STD-810G, Method 514.7, Category 4
• Shock: MIL-STD-810G, Method 516.7, Procedure I
• EMC: EN-50155, CE/FCC Class A, according to EN 55032 & EN 55035

Certificates: CE, FCC i EN 50155

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