To be confirmed
Half-Rack Rugged Fanless Computer Supporting Intel® Xeon® E or 9th/ 8th-Gen Core™ Processor with M12 Connectors.
SEMIL-1300 series is a rugged fanless computer with robust M12 I/O connectors in a standard 2U 19" half-rack form factor enclosure. Powered by Intel® Xeon® E or 9th/ 8th-Gen Core™ CPU and coupled with workstation-grade Intel® C246 chipset, it supports up to 64 GB DDR4 ECC/non-ECC memory and offers flexible mounting options to wall or rack-mount up to two SEMILs side by side.
SEMIL-1300 series incorporates Neousys' best-in-class passive thermal design for proven -40 °C to 70 °C fanless operation. It offers a variety of I/O connectivities utilizing M12 connectors that are reliably robust, cost-effective and can be obtained off-the-shelf. There are also generic I/Os with screw-lock mechanisms to guarantee an extreme-rugged connection in shock and vibration environments. It has four 802.3at PoE+ ports, each supplying 25W of power to the connected device such as an IP or GigE camera. SEMIL-1300 is designed with 4G/5G and WiFi5/WiFi6 wireless connectivity in mind and it supports 8-48V wide-range DC input with ignition power control for in-vehicle use while complying with EN 50155.
In addition, SEMIL-1311J is equipped with Neousys' patented SuperCAP-based UPS containing 2500 watt-second stored energy to sustain and safely shut down the system during unforeseen power outages. It is the perfect solution for data protection and applications in unstable power environments.
With a standard half-rack design, proven wide temperature operation capability, protected against shock/ vibration and power interruption, Neousys' SEMIL-1300 series is the ideal robust solution for extreme-rugged deployment.
Features:
- Intel® Xeon® E or 9th/ 8th-Gen Core™ i7/ i5/ i3 CPU
- 2U half-rack fanless system, -40°C to 70°C operation
- 4x 802.3at Gigabit PoE+, VGA, 2x USB 2.0, 2x COM via M12 connectors
- M.2 B key for 4G/ 5G module, M.2 E key for WiFi module
- Patented supercapacitor-based uninterruptible power backup*(SEMIL-1311J)
- 8~48V wide-range DC input with built-in ignition power control
- CE, FCC and EN 50155 certified
Specification:
System Core:
- Processor: Supporting Intel® Xeon® E and 9th/ 8th-Gen CPU (LGA1151 socket)- Xeon E 2278GE (8C/16T) / 2278GEL (8C/16T) / 2176G (6C/12T)- i7-9700E, i7-9700TE, i7-8700, i7-8700T- i5-9500E, i5-9500TE, i5-8500, i5-8500T- i3-9100E, i3-9100TE, i3-8100, i3-8100T
- Chipset: Intel® C246 platform controller hub
- Graphics: Integrated Intel® UHD Graphics 630
- Memory: Up to 64 GB DDR4-2666/ 2400 SDRAM (two SODIMM sockets)
- AMT: Supports AMT 12.0
- TPM: Supports TPM 2.0
I/O Interface:
- PoE+: 1x IEEE 802.3at (25.5W) Gigabit PoE+ ports by Intel® I219 (M12 X-coded), 3x IEEE 802.3at (25.5W) Gigabit PoE+ ports by Intel® I210 (M12 X-coded)
- 10 GbE Port(Build Option): Optional: 1x 10 GbE port by Intel® X550AT controller (M12 X-coded)
- Native Video Port: 1x VGA (M12 A-coded), supporting 1920 x 1200 resolution, 1x DisplayPort connector, supporting 4096 x 2304 resolution
- Series Port: 2x 3-wires RS-232 ports COM1 & COM2 (M12 A-coded), 1x software-programmable RS-232/ 422/ 485 port (COM3, DB9), 1x RS-232 port (COM4, DB9)
- USB: 3x USB 3.1 Gen1, 2x USB 2.0 (M12 A-coded), 1x USB 2.0 (internal)
- Audio: 1x 3.5 mm jack for mic-in and speaker-out
Storage Interface:
- SATA HDD: 2x Internal SATA port for 2.5" HDD/ SSD installation, supporting RAID 0/ 1
- mSATA: 2x full-size mSATA port (mux with mini-PCIe)
- M.2: 1x M.2 2280 M key socket (PCIe Gen3 x4) for NVMe SSD or Intel® Optane™ memory installation
Expansion Bus:
- Mini PCI-E:2x full-size mini PCI Express sockets (mux with mSATA), 1x M.2 3042/ 3052 B key socket for selected M.2 4G/ 5G module, 1x M.2 2242/ 2252 E key for selected WiFi module
Power Supply:
- DC Input:8V to 48V DC input (M12 S-coded)
- Ignition Control: Built-in ignition power control
Power Backup:
- Capacity: 2500 watt-second
Mechanical:
- Dimension:220mm (W) x 310mm (D) x 86.5mm (H) (excl. rack-mount bracket)
- Weight: 5.8 kg/ 6 kg
- Mounting: Rack-mounting and wall-mounting
Environmental:
- Operating Temperature:with 35W CPU-40°C ~ 70°C **** with >= 65W CPU -40°C ~ 70°C ***/ **** (configured as 35W TDP mode), -40°C ~ 50°C ***/ **** (configured as 65W TDP mode)
- Storage Temperature: -40°C ~85°C
- Humidity: 10%~90% , non-condensing
- Vibration:MIL-STD-810G, Method 514.7, Category 4
- Shock: MIL-STD-810G, Method 516.7, Procedure I
- EMC: EN-50155, CE/FCC Class A, according to EN 55032 & EN 55035
Certificate: CE, FCC and EN 50155
